Wire bonded microfuse and method of making

Details Wire bonded microfuse and method of making Wire bonded microfuse and method of making

1988-06-29

1990-05-08

Broome, H.

Electricity: electrothermally or thermally actuated switches

Electrothermally actuated switches

Fusible element actuated

337208, 337273, H01H 8516

Patent

active

049242032

ABSTRACT:
A microfuse (10) with a ceramic chip (12), thick film pads (14), fusible wire (16), attached to pads (14) without solder or flux, in an insulating enclosure or fuse tube (40). Ferrules (42) are attached to metallized areas (14) with solder (44). Performance and manufacturing of fuse (10) is improved by utilizing a wire bonding technique to improve the quality of the manufacturing process and increase the reliability of the fuse, and to reduce manufacturing cost.

REFERENCES:
patent: 4100523 (1978-07-01), Arikawa
patent: 4417226 (1983-11-01), Asdollahi
patent: 4540969 (1985-09-01), Sugar
patent: 4547830 (1985-10-01), Yamauchi

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