Wire bond tape ball grid array package

Details Wire bond tape ball grid array package Wire bond tape ball grid array package

1995-08-01

1997-09-02

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174261, 174254, 361761, 361765, H05K 102

Patent

active

056635303

ABSTRACT:
A tape ball grid array package reverses the usual attachment of flexible circuitry to a stiffener so that the circuit traces face the stiffener rather than away from the stiffener as is conventional. This construction allows the elimination of a previously necessary solder mask and so reduces the cost to produce the package.

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patent: 5359222 (1994-10-01), Okumoto et al.
patent: 5376588 (1994-12-01), Pendse
patent: 5397921 (1995-03-01), Karnezos
patent: 5572405 (1996-11-01), Wilson et al.
patent: 5578796 (1996-11-01), Bhatt et al.
"Semi Conductor Device" Patent Abstract of Japan, Publication No. JP8064635, 8, Mar. 1996 Mitsui High Tec, Inc., Inventors: Atsushi, et al.
"Semi Conductor Device And Manufacturing Of Manufacture Of Semiconductor Mounting Board" Patent abstract of Japan, Publication No. JP8008352, 122.01.96, Hitachi Cable Ltd., Inventor: Mamoru.

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