Wire bond package and packaging method

Details Wire bond package and packaging method Wire bond package and packaging method

2005-02-22

2005-02-22

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S106000

Reexamination Certificate

active

06858474

ABSTRACT:
A method for packaging a plurality of dies is disclosed. Each die is attached to a corresponding mounting station in a structural member that includes a base member having first and second surfaces and a plurality of mounting stations. Each mounting station has a cavity wall that surrounds that mounting station and extends from the first surface thereby forming an open cavity around the mounting station. After the dies have mounted, a lid sheet is positioned over the structural member. The lid sheet includes a plurality of covers for closing the cavities. The covers are connected to one another by connection members. The structural member with the positioned lid sheet is then placed in a mold with a molding compound in contact with the lid sheet. The mold has a surface that forces the covers against the cavity while forcing the molding compound between the cavity walls.

REFERENCES:
patent: 6143981 (2000-11-01), Glenn
patent: 6415977 (2002-07-01), Rumsey
patent: 6420779 (2002-07-01), Sharma et al.
patent: 6555400 (2003-04-01), Farnworth et al.
patent: 6808947 (2004-10-01), Farnworth et al.

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