Wire bond monitoring system for layered packages

Details Wire bond monitoring system for layered packages Wire bond monitoring system for layered packages

1997-09-08

2000-07-11

Mills, Gregory

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

2281805, B23K 3100, B23K 3102

Patent

active

060859628

ABSTRACT:
A wire bond monitoring system for monitoring wire bonds made on layered packages includes a technique for accessing both the die and the laminate package and making electrical contact thereto so as to test the continuity of the wire bond connection. An electrical connection can be made to a metal trace between the die and the laminate package by contacting a via extending downwardly through the package. Alternatively, a contact may be made from above using a flexible contact. The flexible contact may be attached to the wire bond clamp.

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