Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Patent
1985-05-13
1986-05-06
Godici, Nicholas P.
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Wire lead bonder
228 9, 228104, B23K 2000
Patent
active
045866422
ABSTRACT:
Apparatus is provided for monitoring conditions of a fine wire interconnection during a bonding operation. The apparatus comprise a system which is capable of being installed on new automatic wire bonders or retrofitted into existing automatic wire bonders of the type which employ a main bonding processor for controlling the motion of the bonding tool. The semiconductor to be bonded is connected to a reference voltage and a variable frequency oscillator is magnetically or a.c. coupled to the fine wire above the bonding tool and below the wire feed. The bonding wire incurs changes in inductive and capacitive reactance during the bonding operation which cause variations in the frequency of the oscillator. A series of frequency samples are taken and recorded during a teaching operation in which good wire bond interconnections are made. The recorded frequency samples for each fine wire interconnection are compared to the frequency samples being taken during subsequent bonding operations and decisions are made at critical points of the bonding operation whether or not a good wire bond interconnection is being made without damaging the semiconductor device with excessive force or current.
REFERENCES:
patent: 3192474 (1965-06-01), Cherry
patent: 3302277 (1967-02-01), Pruden et al.
patent: 3763545 (1973-10-01), Spaujer
patent: 4213556 (1980-07-01), Persson et al.
patent: 4373653 (1983-02-01), Salzer et al.
Dreibelbis John D.
Weilerstein I. Marvin
Cuda Carmine
Godici Nicholas P.
Kulicke and Soffa Industries Inc.
Sowell John B.
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