Wire bond integrity tester

Details Wire bond integrity tester Wire bond integrity tester

1975-06-09

1976-03-23

Ruehl, Charles A.

Measuring and testing

Ductility or brittleness

73 95, G01N 314

Patent

active

039452484

ABSTRACT:
A vacuum operated testing device measures the bond integrity of wires connected to integrated circuit modules by applying a known and infinitely variable tensile force to the wire under test.

REFERENCES:
patent: 3323357 (1967-06-01), Gloor
patent: 3572108 (1971-03-01), McShane et al.

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