Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Patent
1998-04-29
2000-05-16
Heinrich, Samuel M.
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Wire lead bonder
228 447, 269903, B23K 3704
Patent
active
060624590
ABSTRACT:
A wire bond clamp for holding lead frame fingers of a plurality of lead frames against a heater block so that electrical connections may be made between the lead frames and IC components. The wire bond clamp includes a baseplate having a plurality of openings. Each of the openings are provided for receiving a clamping insert, which insert has a central aperture therethrough and jaws surrounding the central aperture on a bottom surface of the insert. The central apertures on each clamping insert are sized and positioned so that during a wire bond process, the wire bond clamp may be lowered over a plurality of lead frames and IC components, and tips of the lead frame fingers and the IC components will be located within the central apertures. The jaws of each clamping insert are provided to engage each of the lead frame fingers, and to hold each of the fingers against the heater block. The wire bond clamp further includes mounting pins for pivotally mounting the clamping inserts in the baseplate, and leaf springs for spring loading the clamping inserts downward toward the direction of the lead frames. The spring loaded and pivotal mounting of the clamping inserts in the baseplate allow the inserts to move independently of the baseplate and each other Thus, any deformation in the baseplate is prevented from being transferred to the clamping inserts.
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Advanced Micro Devices , Inc.
Heinrich Samuel M.
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