Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Patent
1998-03-26
2000-05-09
Heinrich, Samuel M.
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Wire lead bonder
228 9, H01L 2160
Patent
active
060591684
ABSTRACT:
The present invention provides a wire bonding apparatus for performing a wire bonding operation on a workpiece having a planar upper surface. The wire bonding apparatus includes a capillary for performing wire bonding and a drive unit for positioning the capillary. The wire bonding apparatus also includes a controller that controls the drive unit and the capillary. This controller generates an equation that defines the plane of the workpiece. Further, the controller determines the difference in height between the home position of the capillary and a selected bonding position on the workpiece based on the equation of the plane. The controller also determines a speed profile for moving the wire bonding apparatus toward the selected bonding position. This speed profile divides the difference in height into first and second sections. Preferably, the second section associated with each bonding position has the same heights. The controller further controls the height of the capillary by providing control signals to the drive unit to sequentially move the capillary through the first and second sections, albeit at different speeds. Finally, the controller generates a bond control signal that is provided to the capillary such that the capillary performs the wire bonding operation upon contacting the bonding position.
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Nam Su-gun
Shin Young-joo
Heinrich Samuel M.
Samsung Aerospace Industries Ltd.
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