Window type BGA semiconductor package and its substrate

Details Window type BGA semiconductor package and its substrate Window type BGA semiconductor package and its substrate

2008-03-27

2010-06-08

Tran, Thien F (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Beam leads

C257S737000, C257S738000, C257SE23069

Reexamination Certificate

active

07732921

ABSTRACT:
A window-type BGA semiconductor package is revealed, primarily comprising a substrate with a wire-bonding slot, a chip disposed on a top surface of the substrate, and a plurality of bonding wires passing through the wire-bonding slot. A plurality of plating line stubs are formed on a bottom surface of the substrate, connect the bonding fingers on the substrate and extend to the wire-bonding slot. The bonding wires electrically connect the bonding pads of the chip to the corresponding bonding fingers of the substrate. The plating line stubs are compliant to the wire-bonding paths of the bonding wires correspondingly connected at the bonding fingers, such as parallel to the overlapped arrangement, to avoid electrical short between the plating line stubs and the bonding wires with no corresponding relationship of electrical connections.

REFERENCES:
patent: 5915166 (1999-06-01), Corisis et al.

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