Window polishing pad

Abrading – Abrading process – Glass or stone abrading

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C451S036000, C451S059000, C451S063000, C451S533000, C451S550000

Reexamination Certificate

active

07455571

ABSTRACT:
A window polishing pad having a reduced stress pad window formed therein for performing optical end point detection are provided, wherein the window polishing pad comprises a pad window and a pressure relief channel, wherein the pressure relief channel extends to an outer periphery of the window polishing pad from a cavity formed behind the pad window when the window polishing pad is interfaced with a platen and wherein a membrane is provided over at least one of an inlet and an outlet of the pressure relief channel. Also disclosed are methods of making and of using the window polishing pads to polish a semiconductor wafer.

REFERENCES:
patent: 6620036 (2003-09-01), Freeman et al.
patent: 6623331 (2003-09-01), Sevilla et al.
patent: 6688945 (2004-02-01), Liu
patent: 6783437 (2004-08-01), He
patent: 6875077 (2005-04-01), Petroski et al.
patent: 7163437 (2007-01-01), Swedek et al.
patent: 7189141 (2007-03-01), Tolles
patent: 7252871 (2007-08-01), Crkvenac et al.
patent: 2007/0037487 (2007-02-01), Kuo et al.
patent: 2007/0054602 (2007-03-01), Bottema et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Window polishing pad does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Window polishing pad, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Window polishing pad will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4038430

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.