Abrading – Machine – Rotary tool
Reexamination Certificate
2002-10-25
2004-12-21
Wilson, Lee D. (Department: 3723)
Abrading
Machine
Rotary tool
C451S006000, C451S288000
Reexamination Certificate
active
06832949
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a window member for chemical mechanical polishing and a polishing pad. More particularly the present invention relates to a window member for chemical mechanical polishing excellent in antifouling property and transparency, and a polishing pad using the same, and also to a window member for chemical mechanical polishing excellent also in anti-scratching and a polishing pad using the same.
2. Description of the Prior Art
When a semiconductor wafer is polished using a slurry by chemical mechanical polishing, a polishing pad is fixed on a surface plate of a polishing apparatus and, on the other hand, a semiconductor wafer is fixed on a lower end of a pressure head and this semiconductor wafer is abutted against the polishing pad while pressing under a prescribed pressure. And, it is known that polishing is performed by sliding a semiconductor wafer and a polishing pad by rotating the surface plate and the pressure head while a slurry is added dropwise on the surface plate at a prescribed amount from a slurry supplying part. As this polishing pad, a resin such as polyurethane is usually used.
However, in this conventional polishing pad, there were problems that the surface of the polishing pad is deteriorated, damaged or colored by repeating polishing and, thus, durability and antifouling property are not sufficient.
In addition, recently, an optical endpoint detecting apparatus and a detecting method that are using an optical method by which the state of a polished surface can be directly observed disclosed in, for example, JP-A-9-7985 and JP-A-2000-3262 are known.
In these optical endpoint detecting apparatus and methods, generally, a window member through which a light for detecting an endpoint can transmit as disclosed in, for example, JP-A-11-512977, and which is comprised of a hard and uniform resin, is formed in a polishing pad, and a surface to be polished is observed through this window member.
As a material constituting this window member, usually, various resins are used. However, there are problems that the surface of the window member is damaged or colored by repeating chemical mechanical polishing and, thus, endpoint detection is interfered.
SUMMARY OF THE INVENTION
The present invention solves the above-mentioned problems and an object of the present invention is to provide a window member for chemical mechanical polishing excellent in antifouling property and transparency, and is excellent also in anti-scratching and a polishing pad using the same. Further, another object of the present invention is to provide a window member for chemical mechanical polishing leads to an easy detection a polishing endpoint of the semiconductor wafer surface by transmitting a light for endpoint detection, for polishing of a semiconductor wafer using an optical endpoint detecting apparatus.
The present invention is based on the findings described above and can be described as follows.
1. A window member for chemical mechanical polishing comprising a substrate part which is transparent partially or all, and an antifouling resin layer formed on at least one side of the substrate part.
2. The window member for chemical mechanical polishing according to 1 above, wherein the antifouling resin layer is comprised of a fluorine-based polymer having a polysiloxane segment in a main chain.
3. The window member for chemical mechanical polishing according to 2 above, wherein the substrate part is comprised of at least one resin selected from the group consisting of a polyester resin, a triacetylcellulose resin, a polycarbonate resin, an allylcarbonate resin, a polyethersulfone resin, a polyacrylate resin, a norbornene resin, an acrylstyrene resin, a polyurethane resin and a polyolefin resin.
4. The window member for chemical mechanical polishing according to 1 above, wherein the antifouling resin layer is cured a curable resin composition comprising an olefin-based polymer having a polysiloxane segment in a main chain, whose content of fluorine is 20 wt % or more, and whose molecular weight is 5,000 or more reduced to polystyrene, and a crosslinkable compound.
5. The window member for chemical mechanical polishing according to 4 above, wherein the olefin-based polymer has a hydroxyl group and/or an epoxy group.
6. The window member for chemical mechanical polishing according to 5 above, wherein the substrate part is comprised of at least one resin selected from the group consisting of a polyester resin, a triacetylcellulose resin, a polycarbonate resin, an allylcarbonate resin, a polyethersulfone resin, a polyacrylate resin, a norbornene resin, an acrylstyrene resin, a polyurethane resin and a polyolefin resin.
7. A polishing pad having a window member for chemical mechanical polishing comprising a substrate part which is transparent partially or all, and an antifouling resin layer formed on at least one side of the substrate part.
8. The polishing pad according to 7 above, wherein the antifouling resin layer is comprised of a fluorine-based polymer having a polysiloxane segment in a main chain.
9. The polishing pad according to 8 above, wherein the substrate part is comprised of at least one resin selected from the group consisting of a polyester resin, a triacetylcellulose resin, a polycarbonate resin, an allylcarbonate resin, a polyethersulfone resin, a polyacrylate resin, a norbornene resin, an acrylstyrene resin, a polyurethane resin and a polyolefin resin.
10. The polishing pad according to 9 above, wherein the window member for chemical mechanical polishing is fixed to a through hole of a substrate for a polishing pad provided with the through hole penetrating from surface to back, or is adhered to the substrate for a polishing pad so as to cover an opening part of the through hole.
11. The polishing pad according to 10 above, further comprising a supporting layer laminated on a back of the substrate for a polishing pad.
12. The polishing pad according to 9 above, wherein the window member for chemical mechanical polishing is inserted between two or more divided substrates for a polishing pad.
13. The polishing pad according to 12 above, further comprising a supporting layer laminated on a back of the substrate for a polishing pad.
14. The polishing pad according to 7 above, wherein the antifouling resin layer is cured a curable resin composition comprising an olefin-based polymer having a polysiloxane segment in a main chain, whose content of fluorine is 20 wt % or more, and whose molecular weight is 5,000 or more reduced to polystyrene, and a crosslinkable compound.
15. The polishing pad according to 14 above, wherein the olefin-based polymer has a hydroxyl group and/or an epoxy group.
16. The polishing pad according to 15 above, wherein the substrate part is comprised of at least one resin selected from the group consisting of a polyester resin, a triacetylcellulose resin, a polycarbonate resin, an allylcarbonate resin, a polyethersulfone resin, a polyacrylate resin, a norbornene resin, an acrylstyrene resin, a polyurethane resin and a polyolefin resin.
17. The polishing pad according to 16 above, wherein the window member for chemical mechanical polishing is fixed to a through hole of a substrate for a polishing pad provided with the through hole penetrating from surface to back, or is adhered to the substrate for a polishing pad so as to cover an opening part of the through hole.
18. The polishing pad according to 17 above, further comprising a supporting layer laminated on a back of the substrate for a polishing pad.
19. The polishing pad according to 16 above, wherein the window member for chemical mechanical polishing is inserted between two or more divided substrates for a polishing pad.
20. The polishing pad according to 19 above, further comprising a supporting layer laminated on a back of the substrate for a polishing pad.
EFFECTS OF THE INVENTION
The window member for chemical mechanical polishing of the present invention is excellent in antifouling property and transparency, and is excell
Hasegawa Kou
Hattori Masayuki
Kawahashi Nobuo
Konno Tomohisa
Motonari Masayuki
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