Window clamp and method of alignement of lead frame strip utiliz

Details Window clamp and method of alignement of lead frame strip utiliz Window clamp and method of alignement of lead frame strip utiliz

1996-08-15

1998-08-18

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

295 491, 295 495, 295105, 295 447, H01L 23495

Patent

active

057961611

ABSTRACT:
The present invention relates to a window clamp and a method of alignment of lead frame strip utilizing the same and, more particularly, to a window clamp and method of alignment of lead frame strip utilizing the same which makes the alignment of the lead frame strip precise, fast and increases yield by sensing an alignment condition of a die and a lead frame by utilizing a window clamp formed with a bonding window and a lead sensing window and by utilizing a sensing means set on a wire bonding equipment to prevent the occurrence of poor quality at the time of wire bonding due to misalignment of the lead frame strip.

REFERENCES:
patent: 4049903 (1977-09-01), Kobler
patent: 5035034 (1991-07-01), Cotmey
patent: 5186719 (1993-02-01), Egashira et al.
patent: 5249726 (1993-10-01), Sato

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