Windblown-type heat-dissipating device for computer mother board

Heat exchange – With retainer for removable article – Electrical component

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Details

165122, 165185, 174 163, 361690, 361697, 361704, 361720, H05K 720

Patent

active

058734074

ABSTRACT:
A windblown-type heat-dissipating device is designed for use on a circuit board, such as a computer mother board, that is installed inside a computer casing having an air inlet, an air outlet, and air sucking means. The heat-dissipating device comprises a base plate; a plurality of heat-conductive members upright mounted on the base plate; and a plurality of air-guide walls, including a first air-guide wall which is arranged substantially in parallel to the first side of the base plate and near the air inlet; a second air-guide wall having a first end arranged on the third side of the base plate and a second end near the center of the base plate, forming a curved shape that can divert the air stream from the air inlet toward the air outlet, and which has a low portion and a high portion; and a third air-guide wall having a first end arranged at the corner between the third side and the fourth side of the base plate and a second end arranged toward the air outlet. In the foregoing structure, the particular arrangement of the air-guide walls allows the air stream from the air inlet to flow evenly over all the heated portions of the heat-conductive members such that the heat-dissipating efficiency is high.

REFERENCES:
patent: 3592260 (1971-07-01), Berger
patent: 3780798 (1973-12-01), Reimer
patent: 3956673 (1976-05-01), Seid
patent: 4790374 (1988-12-01), Jacoby
patent: 5731952 (1998-03-01), Ohgami et al.
patent: 5737187 (1998-04-01), Nguyen et al.

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