Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2011-03-15
2011-03-15
O'Hern, Brent T (Department: 1783)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C139S38300A, C156S194000, C156S304600, C428S107000, C428S156000, C428S213000, C428S364000, C429S144000
Reexamination Certificate
active
07905971
ABSTRACT:
A wide sheet of highly oriented ultra high molecular weight polyethylene comprising a plurality of strips of highly oriented ultra high molecular weight polyethylene partially overlapped or abutted longitudinally to define joints between adjoining strips wherein the thickness of the joint is less than about 80% of the thickness of the sum of the thicknesses of the adjoining strips that make up the joint. A continuous method for the production of such materials comprising subjecting longitudinally overlapping or abutted strips of these materials to temperatures below the melting point of the UHMWPE and pressures over 300 pli is also disclosed.
REFERENCES:
patent: 4879076 (1989-11-01), Sano et al.
patent: 4931126 (1990-06-01), McCarville et al.
patent: 5091133 (1992-02-01), Kobayashi et al.
patent: 5106555 (1992-04-01), Kobayashi et al.
patent: 5106558 (1992-04-01), Kobayashi et al.
patent: 5578373 (1996-11-01), Kobayashi et al.
patent: 6951685 (2005-10-01), Weedon et al.
patent: 2005/0031943 (2005-02-01), Call
patent: 1 627 719 (2006-02-01), None
Harding Kenneth C.
Owen Lisa
Weedon Gene C.
BAE Systems Tensylon H.P. M. Inc.
O'Hern Brent T
LandOfFree
Wide ultra high molecular weight polyethylene sheet and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wide ultra high molecular weight polyethylene sheet and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wide ultra high molecular weight polyethylene sheet and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2714515