Wide frequency band transition between via RF transmission lines

Details Wide frequency band transition between via RF transmission lines Wide frequency band transition between via RF transmission lines

1996-06-11

1998-05-26

Pascal, Robert

Wave transmission lines and networks

Long line elements and components

Strip type

333260, 333 34, 361792, 174262, H01P 308, H01P 500, H05K 111

Patent

active

057572526

ABSTRACT:
A multi-layer circuit structure including a plurality of substrate layers. At least one planar transmission line, including microstrip, stripline, or coplanar line, disposed on the plurality of substrate layers. A via transmission line connected to that at least one planar transmission line and extending through the plurality of substrate layers. The via transmission lines having the same topology as the at least one planar transmission line for providing wide frequency band transition between the via transmission lines and the at least one planar transmission line.

REFERENCES:
patent: 4494083 (1985-01-01), Josefsson et al.
patent: 4626805 (1986-12-01), Jones
patent: 5157477 (1992-10-01), Chance
patent: 5304743 (1994-04-01), Sen et al.
patent: 5401912 (1995-03-01), Mattei
patent: 5408053 (1995-04-01), Young
J.A. Ferrante, G.E. Melvin, E.N. Urfer, "High Conductivity Lines in Multilayer Ceramic Substrates"; IBM Technical Disclosure Bulletin, vol. 21 No. 5; Oct. 1978; pp. 1860, 1861.

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