Wide bandgap semiconductor device construction

Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching

Reexamination Certificate

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C438S017000, C438S750000

Reexamination Certificate

active

10630238

ABSTRACT:
The invention includes methods for precisely and accurately etching layers of wide bandgap semiconductor material. According to one aspect of the invention, the method includes providing a multi-layer laminate including at least a first and second layer of wide bandgap semiconductor material, measuring a first conductance of the first layer of semiconductor material, partially etching the first layer of semiconductor material a first amount, measuring a second conductance of the first layer of semiconductor material etched the first amount, and utilizing the first and second measured conductance to determine a time required to etch the first layer of semiconductor material a second amount.

REFERENCES:
patent: 4314266 (1982-02-01), Temple
patent: 4945394 (1990-07-01), Palmour et al.
patent: 5266503 (1993-11-01), Wang et al.
patent: 5418188 (1995-05-01), Harper et al.
patent: H1637 (1997-03-01), Offord et al.
patent: 5914611 (1999-06-01), Cheng
patent: 6034001 (2000-03-01), Shor et al.
patent: 6180958 (2001-01-01), Cooper, Jr.
patent: 6181200 (2001-01-01), Titizian et al.
patent: 6218254 (2001-04-01), Singh et al.
patent: 6228665 (2001-05-01), Griffith et al.
patent: 6303475 (2001-10-01), Suvorov et al.
patent: 6313482 (2001-11-01), Baliga
patent: 6323506 (2001-11-01), Alok
patent: 6329675 (2001-12-01), Singh et al.
patent: 6331931 (2001-12-01), Titizian et al.
patent: 6790685 (2004-09-01), Lee
Article entitled “Silicon Carbide Bipolar Transistor” by W. V. Munch and P. Hoeck published inSolid State Electronics, 1978, vol. 21, pp. 479-480, Pergamon Press, Great Britain.
Excerpt from textbook vol. VIntroduction to Microelectronic Fabrication, pp. 71-73, author Ricahrd C. Jaeger, Auburn University, published by Addison-Wesley Publishing Company, reprinted with corrections May, 1993.
U.S. Appl. No. 10/360,662, filed on Feb. 7, 2003, entitled “Method of Fabricating Self-Aligned Silicon Carbide Semiconductor Devices”.
U.S. Appl. No. 10/339,040, filed on Jan. 9, 2003, entitled “Silicon Carbide Semiconductor Devices with a Regrown Contact Layer”.

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