Wide array thermal ink-jet print head

Incremental printing of symbolic information – Ink jet – Ejector mechanism

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Details

B41J 201

Patent

active

061132160

ABSTRACT:
The print head includes a substrate having a driver chip attached to a portion of the substrate and a layer of a row of resistors attached to another portion of the substrate. The chip is connected to a plurality of interconnect pads, which are positioned substantially in rows. The driver chip is connected to the resistors individually by circuit traces. The circuit traces are deposited on the substrate in a circuit trace layer. The interconnect pads in a row are spaced a larger distance apart than the resistors. The driver chip is attached to the substrate by a soldering and polymer bonding technique. The technique includes depositing a bondable film layer over the surface of the substrate and interconnect pads, creating openings around the interconnect pads, thereby exposing the pads, and forming a solder ball on each pad. The driver chip is provided with solderable pads, which are positioned near the solder balls. The solder balls and solderable pads are heated to metallically join the chip and interconnect pads, and the film layer is bonded to the chip.

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