Wick structure of heat pipe

Details Wick structure of heat pipe Wick structure of heat pipe

2006-11-14

2006-11-14

Duong, Tho (Department: 3753)

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

C165S104210, C361S700000

Reexamination Certificate

active

07134485

ABSTRACT:
A composite wick structure of a heat pipe which is applied with a tube circumferential surface contacted to a heat source includes a plurality of grooves and a sintered-powder layer. The circular grooves are formed on the internal sidewall of the tubular member. The sintered-powder layer filled in the grooves is attached to at least a portion of the internal sidewall of the tubular member. By the better capillary force provided by the sintered powder, the liquid-phase working fluid can reflow to the bottom side of the heat pipe quickly to enhance the heat transmission efficiency. Further, the problem caused by usage of an axial rod during the process of applying sintered powder can be resolved.

REFERENCES:
patent: 3528859 (1970-09-01), Dey et al.
patent: 3734173 (1973-05-01), Moritz
patent: 3892273 (1975-07-01), Nelson
patent: 4440215 (1984-04-01), Grover et al.
patent: 4470451 (1984-09-01), Alario et al.
patent: 4885129 (1989-12-01), Leonard et al.
patent: 5895868 (1999-04-01), Giammaruti et al.
patent: 6564860 (2003-05-01), Kroliczek et al.
patent: 6997244 (2006-02-01), Hul-Chun
patent: 2003/0141045 (2003-07-01), Oh et al.
patent: 2003/0159809 (2003-08-01), Valenzuela
patent: 2003/0183381 (2003-10-01), Garner et al.
patent: 58110991 (1983-07-01), None

Affiliated with

Also associated with

Rating

Wick structure of heat pipe does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wick structure of heat pipe, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wick structure of heat pipe will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3664130