Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate
2008-09-22
2010-02-02
Pert, Evan (Department: 2826)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
C257S098000, C257SE21001, C257SE33001
Reexamination Certificate
active
07655487
ABSTRACT:
A white light emitting diode (LED) and the packing method thereof are described. The white LED includes a supporting frame, a LED chip, glue for mixing phosphor powder, and phosphor powder, wherein the glue for mixing phosphor powder comprises a first set of compositions and a second set of compositions, the first set of compositions comprises polydimethyl-siloxane, and the second set of compositions comprises the copolymer having dimethyl-siloxane, methyl hydrogen siloxane and vinyl-siloxane wherein the copolymer has a weight percentage from about 94% to 99%, the dimethyl-siloxane has a weight percentage from about 84% to 90%, the methyl hydrogen siloxane has a weight percentage from about 4% to 9%, and the vinyl-siloxane has a weight percentage from about 2% to 7%.
REFERENCES:
patent: 6982045 (2006-01-01), Menkara et al.
patent: 7479662 (2009-01-01), Soules et al.
patent: 2006/0102914 (2006-05-01), Smits et al.
Ningbo Andy Optoelectronic Co., Ltd.
Pert Evan
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