Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate
2009-03-10
2011-10-18
Louie, Wai Sing (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
With housing or contact structure
C257S098000, C257S100000, C257S101000
Reexamination Certificate
active
08039862
ABSTRACT:
A white light emitting diode (LED) package with multilayered encapsulation structure and the packaging methods are disclosed. The white LED package structure includes metal electrodes, a heat dissipation base, a PPA plastic for fixing the electrodes and the heat dissipation base together, at least one LED die, a die attaching material, gold wires for electrically connecting the LED die to the electrodes, a first type of silicone encapsulant, a second type of silicone encapsulant, and a phosphor containing layer. The invention utilizes a low-refractive index silicone (the second type of silicone encapsulant) to separate the phosphor containing layer away from the first type of silicone, which covers the LED die, to prevent/reduce emitted light going backward and hitting the LED die.
REFERENCES:
patent: 6896381 (2005-05-01), Benitez et al.
patent: 2006/0133044 (2006-06-01), Kim et al.
patent: 2008/0023721 (2008-01-01), Lee et al.
patent: 2008/0048201 (2008-02-01), Kim et al.
patent: 2010/0163918 (2010-07-01), Kim et al.
He Yungzhi
Shi Frank
Tran Nguyen The
Jahan Bilkis
Ladas & Parry LLP
Louie Wai Sing
Nepes LED Corporation
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