White gold compositions without nickel and palladium

Metal treatment – Stock – Copper base

Reexamination Certificate

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Details

C148S442000, C420S511000, C420S587000, C420S589000

Reexamination Certificate

active

06863746

ABSTRACT:
The present invention discloses a white gold composition consisting essentially of copper, silver, zinc, and manganese, and further consisting of small amounts of tin, cobalt, silicon/copper and boron/copper. More particularly, the white gold composition of the present invention discloses a white gold composition consisting essentially of about 36% to about 57% copper, about 10% silver, about 18.2% to about 24.2% zinc, about 14% to about 28.9% manganese, and the balance further consisting of about 1% tin, about 0.025% to about 0.03% cobalt, about 0.52% silicon/copper, and about 0.2% boron/copper. An objective of the present invention is to provide for methods and compositions of casting, fabricating and soldering white gold that does not incorporate nickel or palladium. The present invention also discloses no tarnish results when hydrogen is used as a catalyst to all compositions.

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Environmental Health Information Service, “Nickel and Certain Nickel Compounds,”Ninth Report on Carcinogens, 11 pgs, U.S. Department of Health and Human Services (Jan., 2001).

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