Whiskerless plated structure and plating method

Details Whiskerless plated structure and plating method Whiskerless plated structure and plating method

2011-04-26

2011-04-26

McNeil, Jennifer C (Department: 1784)

Metal treatment

Process of modifying or maintaining internal physical...

Producing or treating layered, bonded, welded, or...

C427S383100, C427S375000

Reexamination Certificate

active

07931760

ABSTRACT:
A plated structure is disclosed that includes a base formed of a copper-based material containing copper as a major component, a plating film formed of a tin-based material containing tin as a major component and provided over the base, and a tin-copper compound barrier film located at the boundary between the base and the plating film. The density of the tin-copper compound barrier film is greater than that of copper.

REFERENCES:
patent: 5780172 (1998-07-01), Fister et al.
patent: 2008/0316715 (2008-12-01), Fujii
patent: 0 550 002 (1993-07-01), None
patent: 05-033187 (1993-02-01), None
patent: 11-135226 (1999-05-01), None
patent: 2001-26898 (2001-01-01), None
patent: 2002047593 (2002-02-01), None
patent: 3660798 (2005-03-01), None
patent: 200605184 (2006-02-01), None
English Machine Translation of JP 05-033187, Document Date: Feb. 9, 1993, Translation Date: Oct. 23, 2009.
Glazunova et al., Reactive Diffustion At the Copper-Tin Boundry in Electrodeposition Coatings, Russian/Applied Chemistry, 1987.
Glazunova et al., Reactive Diffustion At the Copper-Tin Boundry In Electrodeposition Coatings, Russian/Applied Chemistry, 1987 (English Translation, Aug. 2010).
Kay et al., Barrier Layers Against Diffusion, Transactions of the Institute of Metal Finishing, vol. 57(4), 1979, pp. 169-174.
Kensaku Mouri et al., “Development of Lead-Free Solder Plating”, Kouchi-Ken Kogyo Gijutsu Center Research Report No. 34, 2003.

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