Wetting of low melting temperature solders by surface active add

Details Wetting of low melting temperature solders by surface active add Wetting of low melting temperature solders by surface active add

1986-04-21

1988-03-29

Rutledge, L. Dewayne

Alloys or metallic compositions

Lead base

Tin containing

420570, 428606, C22C 1106

Patent

active

047342560

ABSTRACT:
A lead based alloy is modified by adding thereto a surfactant consisting of about 0.01 to 0.5 weight percent tellurium, about 0.01 to 0.5 weight percent selenium, about 0.01 to 0.5 weight percent selenium plus about 0.1-0.5 weight percent antimony, and mixtures thereof. The alloy is rapidly solidified by forming a melt thereof containing the surfactant addition and quenching the melt on a moving chill surface at a quenching rate of at least about 10.sup.3 .degree. C./sec. Addition of the surfactant lowers melt surface tension and thereby promotes improved wetting.

REFERENCES:
patent: 2107223 (1938-02-01), Swartz
patent: 2620367 (1952-12-01), Brown
patent: 3644115 (1972-02-01), Hamaguchi et al.
patent: 3664831 (1972-05-01), Graefen
patent: 3793161 (1974-02-01), Manko

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