Wet treatment apparatus for semiconductor wafer

Details Wet treatment apparatus for semiconductor wafer Wet treatment apparatus for semiconductor wafer

1997-03-11

1999-02-23

Coe, Philip R.

Cleaning and liquid contact with solids

Apparatus

With non-impelling fluid deflector or baffle other than...

134186, 134902, B08B 304, B08B 1100

Patent

active

058733817

ABSTRACT:
A wet treatment device for bathing a semiconductor wafer in a processing solution is disclosed. The device includes a processing tank, a discharge ditch around the processing tank, a flow control board located in the processing tank, a supply line supplying processing solution to the processing tank, and a discharge line carrying away processing solution from the discharge ditch. Any two walls in the device are connected in a curved surface having an arc sufficient to reduce accumulation of contaminant matter at the curved surface. A line connects to a wall in a curved annular surface any two walls having an arc sufficient to reduce abrasion at the curved annular surface. The curved surface can be substituted with an approximation of a curved surface so long as the approximation has an arc sufficient to reduce accumulation/abrasion.

REFERENCES:
patent: 3937236 (1976-02-01), Runnells
patent: 3950184 (1976-04-01), Adams et al.
patent: 4955402 (1990-09-01), Miranda
patent: 5370142 (1994-12-01), Nishi et al.
24th Symposium on ULSI Ultra Clean Technology, p. 94.

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