Etching a substrate: processes – Nongaseous phase etching of substrate – Relative movement between the substrate and a confined pool...
Reexamination Certificate
2006-10-17
2006-10-17
Hassanzadeh, Parviz (Department: 1763)
Etching a substrate: processes
Nongaseous phase etching of substrate
Relative movement between the substrate and a confined pool...
Reexamination Certificate
active
07122126
ABSTRACT:
A wet processing apparatus and method that takes advantage of a fluid meniscus to process at least a portion of a surface of an object. After one surface of the object has been processed another side or surface of the object can be similarly processed. This processing can be coating, etching, plating, to name a few. An application of the apparatus and method is in the semiconductor processing industry, especially, the processing of wafers and substrates. The method and apparatus also allows the processing of multiple surfaces of an electronic component.
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Culbert Roberts
Hassanzadeh Parviz
Kenyon & Kenyon LLP
Materials and Technologies Corporation
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