Wet processing using a fluid meniscus, apparatus and method

Etching a substrate: processes – Nongaseous phase etching of substrate – Relative movement between the substrate and a confined pool...

Reexamination Certificate

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Reexamination Certificate

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07122126

ABSTRACT:
A wet processing apparatus and method that takes advantage of a fluid meniscus to process at least a portion of a surface of an object. After one surface of the object has been processed another side or surface of the object can be similarly processed. This processing can be coating, etching, plating, to name a few. An application of the apparatus and method is in the semiconductor processing industry, especially, the processing of wafers and substrates. The method and apparatus also allows the processing of multiple surfaces of an electronic component.

REFERENCES:
patent: 4370356 (1983-01-01), Bok et al.
patent: 5171393 (1992-12-01), Moffat
patent: 5270079 (1993-12-01), Bok
patent: 5279703 (1994-01-01), Haberger et al.
patent: 5339842 (1994-08-01), Bok
patent: 5660642 (1997-08-01), Britten
patent: 5985166 (1999-11-01), Unger et al.
patent: 6555017 (2003-04-01), Rushford et al.

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