Wet processing system

Details Wet processing system Wet processing system

1995-07-20

2000-08-08

Chin, Christopher L.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

118500, 134902, 206711, 206831, 206832, 422 65, 422292, 422297, 422300, 294137, 414222, 414416, 414935, C23F 102

Patent

active

060996862

ABSTRACT:
In a wet processing system included in a semiconductor device production line, a wafer carrier has bars formed with grooves for receiving the edge portions of wafers, and a pair of support plates each having a width smaller than the diameter of the wafers. The carrier reduces a volume required of a processing bath and promotes the smooth flow of aqueous solutions. Hence, the system reduces the consumption of chemicals and pure water as well as the cleaning time and other processing times.

REFERENCES:
patent: 3964957 (1976-06-01), Walsh
patent: 4515104 (1985-05-01), Lee
patent: 5261431 (1993-11-01), Ueno et al.
patent: 5301700 (1994-04-01), Kamikawa et al.

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