Wet lamination process and apparatus

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With work feeding or handling means

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Details

118115, 118249, 118258, 118259, 118266, 118602, 156552, 156578, B05C 108

Patent

active

049768174

ABSTRACT:
Apparatus for wet laminating a photopolymerizable film onto circuit board panels or other substrates. The apparatus is easily and quickly convertible from dry laminating to wet laminating with the rollers therefor mounted in bearing blocks which are insertable in slots in brackets at each end and removable therefrom. The lower roller thereof has a gear the teeth of which are meshable with the teeth of an idler gear for transmission of rotation power thereto. Elongate tubes for applying a fluid, which comprises between about 0.1 and about 10 wt. % of a heterocyclic metal-chelating agent, to the wet insertion rollers for application thereof to the panels are contained in a yoke which is adjustable next to wet insertion rollers for wet laminating or away from dry insertion rollers for dry laminating. The flow rate of fluid to the elongate tubes is controlled, and excess fluid applied to the wet insertion rollers is collected in a tray and returned to the system in order to prevent waste and undesirable environmental effects.

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Technical Paper No. IPC-TP-561, "Optimizing Dry Film Photoresist Lamination for Fine Line Innerlayers", Ripsom and Wopschall (DuPont) Sep./Oct., 1985, presented at IPC Fall Meeting in Los Angeles, CA.

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