Wet etching method using ultraviolet-light and method of...

Etching a substrate: processes – Nongaseous phase etching of substrate – Etching using radiation

Reexamination Certificate

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C438S746000

Reexamination Certificate

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07935266

ABSTRACT:
A substrate supporting film to be etched is held on a rotating stage. Ultraviolet light having a wavelength of 200 nm or shorter radiated from first lamps irradiates the film in air, thereby removing an organic coatings from the film and making the surface of the film hydrophilic. A chemical solution is applied to the hydrophilic film while rotating the substrate. Ultraviolet light having a wavelength longer than 200 nm is radiated from second lamps and onto the film through the chemical solution.

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Nobuyuki Hishinuma, “Surface Treatment Technology Handbook (Jan. 2000)”, Excerpt from vol. 2 “Applications,” Chapter 1 Treatment Methods Excimer UV (with English Translation).

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