Wet-etchable random polyimide copolymer for multichip module app

Details Wet-etchable random polyimide copolymer for multichip module app Wet-etchable random polyimide copolymer for multichip module app

1993-04-26

1995-02-28

Kight, III, John

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From carboxylic acid or derivative thereof

528125, 528128, 528170, 528172, 528173, 528176, 528183, 528185, 528188, 528220, 528229, 528350, 528351, C08G 7310, C08G 6926

Patent

active

053938640

ABSTRACT:
A random polyimide copolymer, based on a rigid dianhydride, a rigid diamine and an additional diamine and/or dianhydride containing one or more flexibilizing linkages. Soft-baked coatings of the poly(amic acid) precursor are readily processed using conventional aqueous base developers, such as tetramethylammonium hydroxide. The polyimide and soft-baked coatings are useful as a dielectric layer In multichip module applications or as a stress buffer coating.

REFERENCES:
patent: 4623563 (1986-11-01), Noda et al.
patent: 4778872 (1988-10-01), Sasaki et al.
patent: 5138028 (1992-08-01), Paul et al.
patent: 5162492 (1992-11-01), Kaku
patent: 5166292 (1992-11-01), Pottiger et al.
patent: 5166308 (1992-11-01), Kreuz et al.
patent: 5196500 (1993-03-01), Kreuz et al.

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