Wet/dry substrate processing apparatus

Metal working – Barrier layer or semiconductor device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

20429825, H01L 2100, H01L 2164, C23C 1400, C23C 900

Patent

active

060773219

ABSTRACT:
A buffer chamber is provided between a transfer chamber and a cleaning/drying chamber, and completely-closable shutters are provided between the transfer chamber and the buffer chamber as well as between the buffer chamber and the cleaning/drying chamber. The cleaning/drying chamber serving as a composite processing part including a processing in the wet atmosphere is connected with the remaining chambers of dry atmospheres.

REFERENCES:
patent: 4917556 (1990-04-01), Stark et al.
patent: 4951601 (1990-08-01), Maydan et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Wet/dry substrate processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wet/dry substrate processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wet/dry substrate processing apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1848474

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.