Wet cleaning process and wet cleaning equipment

Details Wet cleaning process and wet cleaning equipment Wet cleaning process and wet cleaning equipment

2005-03-15

2005-03-15

Kornakov, M. (Department: 1746)

Cleaning and liquid contact with solids

Processes

With work or work parts movable during treatment

C134S002000, C134S025100, C134S026000, C134S029000, C134S034000, C438S906000, C510S175000

Reexamination Certificate

active

06866723

ABSTRACT:
A wet treatment method useful in one of a chemical processing and a rinsing step performed upon fabrication of semiconductor devices. A substrate is treated with a desired liquid while revolving the substrate around an axis of rotation outside the substrate such that the liquid flowing on a surface of the substrate is maintained flowing under a centrifugal force greater than gravitation. The substrate is treated while supplying the liquid at a flow rate at least equal to a discharge rate of the liquid only in a direction conforming with that of the centrifugal force or with that of a flow of the liquid flowing on the surface of the substrate under the centrifugal force. The substrate surface is evenly treated with the liquid while avoiding flows of the liquid running against each other or a flow of the liquid stagnating on the surface of the substrate.

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