Wet chemical treatment system and method for cleaning such syste

Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...

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134 10, 134 254, 134 26, 134 28, 134 41, 1341041, 134108, 134111, 134902, B08B 304, B08B 900, B08B 908, C23G 102

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active

058206892

ABSTRACT:
A wet chemical treatment system for processing semiconductor wafers that does not have the problem of cracking or other damages occurring in the system during a cleaning process where a strong acid and water are mixed and pressure and heat are generated. The system includes an additional filing system such that only an outer tank for the processing liquid is filled after the system is cleaned so that pressure and heat generated by the reaction between acid and water can be released into an empty inner tank and thus avoiding damages caused by the heat and pressure. A method for cleaning such system is further disclosed.

REFERENCES:
patent: 4302273 (1981-11-01), Howard, Jr.
patent: 5000795 (1991-03-01), Chung et al.
patent: 5190065 (1993-03-01), Kovac et al.

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