Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Patent
1996-07-26
1998-05-05
Gorgos, Kathryn L.
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
205123, 205125, 427 98, 430313, C25D 502
Patent
active
057469032
ABSTRACT:
Methods of forming high-aspect ratio blind apertures and thereafter filling the apertures with a plating solution are disclosed. A layer of photosensitive material is pattern exposed to actinic radiation to define the apertures, and thereafter exposed to aqueous developer solution. The apertures are then rinsed with water and thereafter exposed to plating solution without drying the aperture of water or developer solution. This is contrary to conventional practice where photoresist layers are dried, and usually post-baked after the development step in order to improve dimensional integrity and reduce swelling of the photoresist material. However, the inventors have recognized that the conventional drying and post-baking steps forever destroy the best opportunity to wet the walls of high-aspect ratio apertures with water, and have discovered that continually maintaining water within the aperture between the development and electroplating steps provides the best opportunity to fill the apertures with plating solution.
REFERENCES:
patent: 3013955 (1961-12-01), Roberts
patent: 3615465 (1971-10-01), Bullinger
patent: 3930963 (1976-01-01), Polichette et al.
patent: 4057663 (1977-11-01), Preston
patent: 4576743 (1986-03-01), Kita et al.
patent: 4751170 (1988-06-01), Mimura et al.
patent: 4931149 (1990-06-01), Stierman et al.
patent: 4981770 (1991-01-01), Taylor
patent: 5015538 (1991-05-01), Krause et al.
patent: 5025280 (1991-06-01), Lamb et al.
patent: 5077176 (1991-12-01), Baggio et al.
patent: 5110709 (1992-05-01), Aoai et al.
patent: 5158860 (1992-10-01), Gulla et al.
patent: 5166037 (1992-11-01), Atkinson et al.
Beilin Solomon I.
Chou William T.
Lee Michael G.
Wang Wen-chou Vincent
Fujitsu Limited
Gorgos Kathryn L.
Mayekar Kishor
LandOfFree
Wet chemical processing techniques for plating high aspect ratio does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wet chemical processing techniques for plating high aspect ratio, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wet chemical processing techniques for plating high aspect ratio will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-50210