Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent
1986-05-12
1987-12-22
James, Andrew J.
Electricity: conductors and insulators
Feedthrough or bushing
Compression
357 74, 357 80, 174 16HS, H01L 2334, H01L 2336
Patent
active
047149531
ABSTRACT:
An improved thermal management technique is disclosed for use in semiconductor device packaging utilizing ultrasonic welding to attach aluminum wires of predetermined diameter at one end directly to preselected hot spots on the device and at the other end to thermally conductive package elements.
REFERENCES:
patent: 3681513 (1972-08-01), Hargis
Cain & Ordonez, vol. 19, No. 5, Oct. 76, p. 1802 IBM TDB "Semiconductor Module with Improved Air Cooling".
Ciancanelli, vol. 19, No. 7, Dec. 76, p. 2652 IBM TDB "Circuit Module with Heat Transfer.
Buller Marvin L.
Lumbra Douglas L.
Phelps Douglas W.
Samuelsen Sigvart J.
Ward William C.
Bryant Andrea P.
International Business Machines - Corporation
Jackson Jerome
James Andrew J.
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