Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Metal and nonmetal in final product
Reexamination Certificate
2005-08-09
2008-10-14
Turner, Archene (Department: 1794)
Powder metallurgy processes
Powder metallurgy processes with heating or sintering
Metal and nonmetal in final product
C264S125000, C228S903000, C419S018000
Reexamination Certificate
active
07435377
ABSTRACT:
A weldable ultrahard insert can include an ultrahard working layer and a weldable metal layer metallically bonded with the working layer. The ultrahard working layer can be any ultrahard material such as PCD, PCBN, metal carbide, ceramic, diamond, or the like. The weldable ultrahard inserts can be formed by charging a reaction vessel with ultrahard materials, including precursors thereof, and placing a weldable metal layer in the reaction vessel with an optional intermediate layer. The assembly can be subjected to a pressure and a temperature sufficient to metallically bond the weldable metal layer to the ultrahard material. The weldable layer is formed as part of the insert in situ which facilitates subsequent welding of the insert to a tool substrate without risking damage to the ultrahard material.
REFERENCES:
patent: 3745623 (1973-07-01), Wentorf et al.
patent: 4906528 (1990-03-01), Cerceau et al.
patent: 5009673 (1991-04-01), Cho
patent: 5030276 (1991-07-01), Sung et al.
patent: 5075053 (1991-12-01), Bernadic et al.
patent: 6454027 (2002-09-01), Fang et al.
Cho Hyun Sam
Han Kyung Ryul
Valentine Tim
ADICO, Asia Polydiamond Company, Ltd.
Thorpe North & Western LLP
Turner Archene
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