Wedge wire bonding tool tip

Details Wedge wire bonding tool tip Wedge wire bonding tool tip

1994-05-31

1995-08-29

Heinrich, Samuel M.

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

228 45, H01L 21607, B23K 2010

Patent

active

054453062

ABSTRACT:
A wedge bond tool tip (20, 30, 50, 56) for bonding electronic interconnects to bonding pads of a semiconductor device enables fine-pitch non-orthogonal wire bonding. The tool tip (20, 30, 50, 56) has an overall width and a front face (12', 52) that has a reduced area which is narrower than the overall width. The reduction in the front face is accomplished through either chamfering or rounding of the corners to reduce the contact distance (42 and 44) between the wedge tool and a previously made adjacent bond. This design maintains the structural integrity needed to produce acceptable wedge bonds.

REFERENCES:
patent: 3623649 (1971-11-01), Keisling
patent: 3627192 (1971-12-01), Killingsworth
patent: 3690538 (1972-09-01), Gaiser et al.
patent: 3718272 (1973-02-01), Eltzroth et al.
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patent: 3934783 (1976-01-01), Larrison
patent: 3971499 (1976-07-01), Goodrich, Jr. et al.
patent: 4030657 (1977-06-01), Scheffer
patent: 4778097 (1988-10-01), Hauser
patent: 5148959 (1992-09-01), Cain et al.
patent: 5217154 (1993-06-01), Elwood et al.
Micro-Swiss product information on Fine Pitch Bonding Wedge, Models 41436, 44129, 49436, 40424,40427, 40428, 40460, 44200.
Small Precision Tools product information on Auto Bonding Tools.
Gaiser Tool Company product information on Bonding Wedges.

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