Wedge bump bonding apparatus and method

Details Wedge bump bonding apparatus and method Wedge bump bonding apparatus and method

1993-05-10

1994-11-15

Ramsey, Kenneth J.

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

228 45, H01L 21607

Patent

active

053640047

ABSTRACT:
An apparatus for applying interconnect bumps to an integrated circuit comprising a wedge bonder assembly (10) including a bonding tool (14) adapted to be selectively moved relative to the integrated circuit (42) and to transmit ultrasonic force to bond wire or ribbon (62) located between the bonding tool (14) and the integrated circuit (42) to the integrated circuit and form an interconnect bump (63), the bonding tool (14) defining a passage (44) through which wire or ribbon (50) is passed to be brought into contact with the integrated circuit (42) and an edge (38) positioned and adapted to weaken wire or ribbon (50) as the bonding tool (14) is moved to the point at which the bonding tool (14) is closest to the integrated circuit (42), the wedge bonder assembly being adapted to move the bonding tool (14) so as to separate the interconnect bump (63) from the wire or ribbon (50) proximal of the bump.

REFERENCES:
patent: 4418858 (1983-12-01), Miller
patent: 4718591 (1988-01-01), Hill
patent: 5058798 (1991-10-01), Yamazaki et al.
Brochure: Hughes Model 2470-III Automatic Wedge Bonder 1991.
Operation Manual: Model 2470-111 Oct. 1991; pp. 3-3 to 3-15.
Brochure: Ultrasonic Bonding Tools For Ultrasonic Wire Bonding; Small Precision Tools; 8-1990-91, pp. 1-35.

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