Wedge-bonding of wires in electronic device manufacture with...

Details Wedge-bonding of wires in electronic device manufacture with... Wedge-bonding of wires in electronic device manufacture with...

2003-08-07

2008-08-19

Lorengo, Jerry (Department: 1793)

Metal fusion bonding

Process

Plural joints

C228S004500, C228S110100, C228S001100

Reexamination Certificate

active

07413108

ABSTRACT:
In the manufacture of electronic devices (22, 22′), e.g. discrete semiconductor power devices or ICs, a reversible bonding tool (10) is used having a bonding tip or wedge (1, 2) at each of its opposite ends (11, 12). After extensive use of the wedge-tip (1) at one end (11) for bonding wires (21), the tip (1) is worn somewhat. Instead of needing to replace the bond tool as in the prior art, the tool (10) in accordance with the invention is then reversed to use the wedge-tip (2) at the opposite end (12) for bonding further wires (20′). Thus, a cost saving is achieved with regard to tool material.

REFERENCES:
patent: 3054309 (1962-09-01), Elmore et al.
patent: 3627192 (1971-12-01), Killingsworth
patent: 3813006 (1974-05-01), Holze, Jr. et al.
patent: 5364004 (1994-11-01), Davidson
patent: 5702049 (1997-12-01), Biggs et al.

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