Wedge assembly

Joints and connections – Having a cam – wedge – or tapered portion

Patent

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Details

254104, 361415, F16B 214

Patent

active

043547702

ABSTRACT:
A wedge assembly for securing a circuit board in an electronic package gi positive surface contact and excellent heat transfer between the multi-layer board and the electronic package as well as positive lock under vibration and shock. A housing, which may be mounted on a multi-layer board, contains a wedge member having two ramped ends within an open cavity having a single ramped end. Means such as a ramped anvil which slides within the cavity under force from a screw is provided within the cavity for adjusting the wedge member relative to the housing to provide positive contact between the electronic package and the multi-layer board.

REFERENCES:
patent: 1217539 (1917-02-01), Underwood
patent: 2735650 (1956-02-01), Lee et al.
patent: 3418534 (1968-12-01), Koons et al.
patent: 3678342 (1972-07-01), Shaw
patent: 3735206 (1973-05-01), Pesek
patent: 4089043 (1978-05-01), Fraboni et al.
patent: 4157583 (1979-06-01), Basmajian et al.
patent: 4189219 (1979-04-01), Kraft

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