Wax-flux composition containing a succinimide salt of an alkylar

Metal treatment – Compositions – Fluxing

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228180R, 228212, 228223, C23K 3534

Patent

active

040281434

ABSTRACT:
Wax-flux compositions for use in low-temperature soldering processes comprise (A) a major amount of a wax and (B) an effective amount to cause fluxing, at or below the soldering temperature of the piece to be soldered, of a wax-soluble product obtained by first reacting an aliphatic hydrocarbon-substituted succinic acid or derivative thereof which is capable of forming carboximide bonds with an alkylene polyamine to form a carboximide and then reacting said carboximide with an alkylaryl sulfonic acid. A process for soldering electrical components to a printed circuit board comprises (A) applying a molten wax-flux composition as described above to the metal pattern side of the board, (B) allowing the wax-flux composition to solidify, (C) trimming the components leads, and (D) soldering the components to the printed circuit board.

REFERENCES:
patent: 2687362 (1954-08-01), Rueggeberg
patent: 2898255 (1959-08-01), Thompson
patent: 3568295 (1971-03-01), Moran
patent: 3574934 (1971-04-01), DeRose
patent: 3680762 (1972-08-01), Kondo
patent: 3780431 (1973-12-01), Feenem
patent: 3944123 (1976-03-01), Jacobs
patent: 3966110 (1976-06-01), Boynton

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