Wavelength conversion chip for use in solid-state lighting...

Radiant energy – Invisible radiation responsive nonelectric signalling – Luminescent device

Reexamination Certificate

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C250S483100

Reexamination Certificate

active

11389311

ABSTRACT:
A wavelength conversion chip is formed by depositing a wavelength conversion material layer on a substrate, segmenting the wavelength conversion layer into a plurality of wavelength conversion chips, and then removing the wavelength conversion chips from the substrate. The wavelength conversion of the chips can be increased by thermal annealing or radiation annealing of the wavelength conversion material. Optical coatings or light extraction elements can be fabricated on the wavelength conversion layer.

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patent: 6630691 (2003-10-01), Mueller-Mach et al.
patent: 6667574 (2003-12-01), Aoki et al.
patent: 6696703 (2004-02-01), Mueller-Mach et al.
patent: 2003/0217806 (2003-11-01), Tait et al.
patent: 2004/0145895 (2004-07-01), Ouderkirk et al.
patent: 2005/0006659 (2005-01-01), Ng et al.
patent: 2005/0051790 (2005-03-01), Ueda
patent: 2005/0077532 (2005-04-01), Ota et al.

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