Waveguide window assembly and microwave electronics package

Details Waveguide window assembly and microwave electronics package Waveguide window assembly and microwave electronics package

1998-01-14

1999-11-16

Reichard, Dean A.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 51, H05K 506

Patent

active

059862084

ABSTRACT:
A microwave electronics package has a microwave waveguide window assembly hermetically sealed to the electronics package using an intermediate bimetallic bushing. The metallic components of the bimetallic bushing have thermal properties similar to the thermal properties of the housing and waveguide window frame, respectively, permitting the use of fusion welding techniques such as laser welding to hermetically seal the waveguide assembly in the housing and to preserve the integrity of the waveguide window during fusion welding and during thermal cycling of the electronics package. A microwave grounding element is also provided in the assembled electronics package to provide a continuous microwave ground path.

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