Waveguide to microstrip backshort with external spring compressi

Amplifiers – Involving structure other than that of transformers per se – With printed circuits

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Details

330 68, 330286, 333 26, H03F 100, H01P 5107

Patent

active

060407395

ABSTRACT:
A new amplifier module construction enhances the manufacturer's ability to repetitively construct multiple copies of millimeter microwave amplifiers having performance characteristics that are consistent with one another, particularly in input VSWR ratio characteristic, and which performance characteristic do not significantly change following any necessary rework of the amplifier module, including any MMIC chip replacement. In this module, a waveguide to microstrip transition is formed of a backshort member that is separate from the metal base or cover and that backshort member is held pressed in place against the substrate by force exerted by the module's cover plate through a spring member against the exterior of the backshort member. The spring member is formed by a resilient compressible gasket.

REFERENCES:
patent: 5235300 (1993-08-01), Chan et al.
patent: 5414394 (1995-05-01), Gamand et al.
patent: 5770981 (1998-06-01), Koizumi et al.
patent: 5912598 (1999-06-01), Stones et al.

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