Wave soldering with supported inclined wave

Metal fusion bonding – Process – Plural joints

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Details

228260, 228 37, B23K 108, B23K 3102

Patent

active

039891801

ABSTRACT:
Workpieces, such as printed circuit boards, are processed by passing the boards in contact with a standing wave of molten solder formed by circulating molten solder upwardly through a nozzle to overflow at least one edge thereof to form a standing wave which is accelerated by gravity so as normally to have an upper surface ballistically curved in the direction of flow. In accordance with the invention, the undersurface of the standing wave is supported to have a ballistic curvature, in the direction of flow, such that a major portion of the upper surface of the wave is substantially planar with the cross-sectional area of the wave varying, in the direction of flow, in a manner similar to the variation of the cross-sectional area of an unsupported wave following a ballistic curve in is trajectory. This results in the upper surface of the wave being substantially planar throughout a major portion of its length, and inclined downwardly from the horizontal, at a small angle, in the direction of flow of the solder. The angle to the horizontal may be varied between 3.degree.-10.degree. but preferably is from 4.degree. to 6.degree.. Supporting of the undersurface of the wave is effected by an extension of at least one wall of the nozzle, in the direction of solder flow, this extendsion having a ballistic curvature in the direction of solder flow of an extent such that the upper surface of the standing wave is substantially flat and inclined downwardly in the direction of the flow.

REFERENCES:
patent: 2993272 (1961-07-01), Carlzen et al.
patent: 3100471 (1963-08-01), Gutbier
patent: 3605244 (1971-09-01), Osborne et al.
patent: 3713876 (1973-01-01), Lavric
patent: 3726007 (1973-04-01), Keller
patent: 3726465 (1973-04-01), Boynton et al.
patent: 3921888 (1975-11-01), Elliot et al.

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