Wave soldering tank

Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid

Reexamination Certificate

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Details

C228S033000, C228S034000, C228S260000

Reexamination Certificate

active

07905382

ABSTRACT:
A wave soldering tank is provided on which it is easy to perform maintenance, which does not have fluctuation of the height of spouted solder, which does not damage the rotating shaft of a discharge pump, and which can be stably used for long periods.The wave soldering tank1has a tank body1awhich houses molten solder S, a discharge pump5which pumps molten solder S, a discharge nozzle4which spouts molten solder S which was sent to it by the discharge pump5upwards, a duct2having the discharge pump5installed at one of its ends and the discharge nozzle4installed at its other end, an oxidation preventing member22which has a prescribed size and which floats on the surface of the molten solder S, and an engaging means13which controls rotation of the oxidation preventing member22in a horizontal plane. The oxidation preventing member22has a surrounding member28which extends downwards at its center and which surrounds the rotating shaft10with a gap between it and the rotating shaft10, and a hollow space26in its interior for providing buoyancy.

REFERENCES:
patent: 5209389 (1993-05-01), Sullivan et al.
patent: 5566875 (1996-10-01), Hwang
patent: 2008/0093417 (2008-04-01), Takaguchi et al.
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patent: 0336362 (1991-04-01), None
patent: 05050224 (1993-03-01), None
patent: 0619968 (1994-03-01), None
patent: 06246433 (1994-09-01), None
patent: 2000114708 (2000-04-01), None
patent: 2000114708 (2000-04-01), None

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