Metal fusion bonding – Process – With protecting of work or filler or applying flux
Patent
1995-08-01
1997-10-21
Bradley, P. Austin
Metal fusion bonding
Process
With protecting of work or filler or applying flux
228232, 228 201, 228 37, H05K 334, B23K 300
Patent
active
056787529
ABSTRACT:
A liquid flux using water instead of a volatile organic compound as the liquid carrier is used in a wave soldering process. Undesirable formation of solder balls, solder bridges and solder webbing is prevented by using an air knife to direct a vigorous jet of gas at the dielectric substrate in the preheating section.
REFERENCES:
patent: 4648547 (1987-03-01), Mahler et al.
patent: 4708281 (1987-11-01), Nelson et al.
patent: 5379943 (1995-01-01), Gibson
Kaminsky Mike
Noreika Richard
Oxx, Jr. George D.
Potsko Daniel
Bradley P. Austin
International Business Machines - Corporation
Knapp Jeffrey T.
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