Wave-soldering of printed circuit boards

Details Wave-soldering of printed circuit boards Wave-soldering of printed circuit boards

1982-01-12

1985-07-23

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228 37, 228260, 2281801, B23K 112, H05K 334

Patent

active

045304572

ABSTRACT:
Wave soldering apparatus particularly adapted for soldering printed circuit boards which have closely packed chip components adhesively mounted on one side of the boards is described. A novel nozzle assembly is dimensioned to be mounted to the solder supply conduit of a conventional wave soldering reservoir. The nozzle assembly comprises a first nozzle which delivers a turbulent jet to the undersides of the printed circuit boards as they are conveyed over the nozzle assembly, and a second nozzle which delivers a smooth laminar wave through which the undersides of the printed circuit boards immediately subsequently pass. The turbulent jet forces solder into the restricted spaces at which chip component contact pads are located and the smooth wave completes this soldering action by building of additional solder in a manner which discourages the formation of solder "icicles" and bridging.

REFERENCES:
patent: 3921888 (1975-11-01), Elliot et al.
patent: 4101066 (1978-07-01), Corsaro et al.
patent: 4139881 (1979-02-01), Shimizu et al.
patent: 4465219 (1984-08-01), Kondo

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