Wave soldering method and apparatus

Details Wave soldering method and apparatus Wave soldering method and apparatus

1993-05-26

1994-03-29

Rowan, Kurt C.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228260, 228 37, B23K 2014, B23K 108

Patent

active

052977242

ABSTRACT:
Wave soldering method and apparatus for fluxing a substrate in a low oxygen containing atmosphere, preheating the fluxed substrate at least partially in a non-low oxygen containing atmosphere, and soldering the preheated substrate in a low oxygen containing atmosphere.

REFERENCES:
patent: 3218193 (1965-11-01), Isaacson
patent: 4871105 (1989-10-01), Fisher et al.
patent: 5090651 (1992-02-01), Mittag
patent: 5203489 (1993-04-01), Gileta et al.
patent: 5230460 (1993-07-01), Deamborsio et al.

Affiliated with

Also associated with

Rating

Wave soldering method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wave soldering method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wave soldering method and apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-786465