Wave soldering machine and method of adjusting and automatically

Details Wave soldering machine and method of adjusting and automatically Wave soldering machine and method of adjusting and automatically

1996-09-24

1999-05-11

Heinrich, Samuel M.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

228 8, 118429, H05K3/34

Patent

active

059018992

ABSTRACT:
The invention relates to a wave soldering machine with at least one device for generating at least one solder wave (10a) consisting of liquid solder (10) for wetting assembled units (22) which are conducted over the solder wave (10a). To achieve a reproducible adjustment and control of the wave height (24), it is proposed to mount at least one temperature-compensated pressure sensor (18) in the transport path of the solder (10), preferably in the immediate vicinity of the nozzle opening (13).

REFERENCES:
patent: 3726465 (1973-04-01), Boynton et al.
patent: 4773583 (1988-09-01), Ishii et al.
patent: 4890781 (1990-01-01), Johnson et al.
patent: 5467914 (1995-11-01), Peterson et al.
patent: 5615828 (1997-04-01), Stoops
"Fundamentals of Fluid Mechanics", Philips M. Gerhart, Richard J. Gross, Addison-Wesley Publishing Co.

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