Wave soldering machine

Details Wave soldering machine Wave soldering machine

1996-08-05

1998-06-30

Heinrich, Samuel M.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

228260, B23K 306, H05K 334

Patent

active

057721017

ABSTRACT:
A wave soldering machine welling up molten solder by means of a pump for soldering a printed circuit board. The wave soldering machine comprises a nozzle formed of an enclosure surrounded by a front upright, a rear upright and side plates, a rear baffle plate extended from the top edge of the rear upright in a manner that the height of the rear baffle plate is adjusted, and a generally L-shaped front baffle plate having a large radius of curvature pivotally attached to the top edge of the front upright, whereby a solder wave formed on the top end of the rear baffle plate by surface tension of molten solder flows along the top surface of the front baffle plate. The rear baffle plate is particularly shaped and a bypass is formed to present a stable solder wave.

REFERENCES:
patent: 3119363 (1964-01-01), Rieben
patent: 3989180 (1976-11-01), Tardoskegyi
patent: 4465014 (1984-08-01), Bajka et al.
patent: 4465219 (1984-08-01), Kondo
patent: 4568012 (1986-02-01), Kakuhata et al.
patent: 4773583 (1988-09-01), Ishii et al.
patent: 5379931 (1995-01-01), Ban Schaik
Soldering in Electronics, by R.J. Klein Wassink, pp. 328-361, published in 1984, Electrochemical Publications Limited.

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